Plasma Generators T&C has created a practical and cost sensitive approach to power delivery systems designed specifically for: Metal and dielectric etching, Photoresist ashing, Sputter deposition, Chemical vapor deposition (CVD), Plasma-enhanced chemical vapor deposition (PECVD), Physical vapor deposition (PVD), RF cleaning These plasma systems will ignite and maintain plasmas by following the changes in the process to provide stable and consistent operation. T&C has "off the shelf" systems that can plug into your current application and provide better control of process than is available from other, more expensive manufacturers. We are also have or are willing to design special monitor and control interfaces for specific applications. The ability to monitor Forward, Reflected and Load power in real time provides an ability to control and repeat a process consistently time after time. Combined with precise power control and frequency agility, process management can be fine-tuned to a degree better than previously expected.       Model Frequency range Power Control Operation Data sheet 03 380 380 kHz 300 W analog/digital via Interface   06 380 380 kHz 500 W analog/digital via Interface   06 450 450 kHz 500 W analog/digital via Interface   0113 13.56 MHz 100 W analog/digital via Interface   0313 13.56 MHz 300 W analog/digital via Interface   0613 13.56 MHz 600 W analog/digital via Interface   1213 13.56 MHz 1200 W analog/digital via Interface   AG 0113 13.3 to 13.8 MHz 100 W analog/digital via Interface and front panel   AG 0313 13.3 to 13.8 MHz 300 W analog/digital via Interface and front panel   AG 0613 13.3 to 13.8 MHz 600 W analog/digital via Interface and front panel

Plasma Matching Networks       Model Frequency Input impedance nom. power max. power Data sheet ATN-5 13.56 MHz 50 Ohm 500 W 1000 W   ATN-10 13.56 MHz 50 Ohm 1000 W 2000 W   ATN-15 13.56 MHz 50 Ohm 1500 W 2000 W   MN-500 13.56 MHz 50 Ohm 500 W 500 W